OSP( Organic Solderability Preservative) is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering.

OSP is designed to produce a copper layer on the PCB. this coating protects the circuitry from oxidization during storage and assembly operations, It has been around for quite a while but is only recently gaining popularity with the research for lead-free techniques.

It uses a water-based organic compound that rusts in a normal environment. However. at subsequent welding temperatures, the protective film will be easily removed by the flux, this will cause the copper exposed outside in the air and oxidated. 

The copper oxide is hard to puncture and resists the carrying current.

High Spring Loaded Probes are specially designed and manufactured to puncture the copper oxide to make sure the high first passed yield.

OSP test probes are designed into different sharp dagger probes, we provide a variety of probes and utilize the probe daggers to cut the copper ring and make a good stable contact, OSP test probes are high spring force needles. 

The OSP Probes are a part of the FLUX BUSTER Probes, specifically designed to penetrate heavy oxide layers, contaminates, flux, and conformal coatings.  The OSP Probe is an extremely high-contact pressure probe.  Available in 100 mil 75mil 50mil grids, the OSP Probe features a 280-gram spring force at a 6.25mm travel that is coupled with an extremely sharp Chiseled Spear (SP) tip made of tool steel.  This provides extremely effective penetration of OSP coatings and other contaminants.

Tip solution

J100-21-090-28   dagger 30° aggressive

J100-22-090-28   dagger 120° passive

J100-23-090-28   dagger 90° aggressive

J100-24-090-28   dagger 150° passive