In the semiconductor industry, a "bare die" refers to a small, unpackaged semiconductor chip that has been manufactured but has not yet been assembled into a final product. The bare die typically consists of a small square or rectangular piece of silicon with electronic circuits etched onto its surface.
those bare die silicon are common to a final package before doing the assembly, they are needed to clean tested with no footprints.
we JYPROBE provides a massively qualified and manufactured test sockets for ATE or open-top quick testing, upto 200amp current in small size 3.5x3.5mm.
this bare die ic test socket can keep a very soft contact over 20 million cycles lifespan.
1.lower working travel
2.lower spring force compared to normal Cantilever probe
3.lower contact resistance on each pin.
bare die IC test socket
JYPROBE'S SOFT-CONTACT TEST SOCKET FOR TESTING BARE DIE SILICON CARBIDE UPTO 200AMP
Phone: +86-21-37695886| Email：sales@jyprobe.com| Add: A506, No. 1000, Jiujing Road, Songjiang, Shanghai, China.
TRADE MARK HELD BY JIANYANG