In the semiconductor industry, a "bare die" refers to a small, unpackaged semiconductor chip that has been manufactured but has not yet been assembled into a final product. The bare die typically consists of a small square or rectangular piece of silicon with electronic circuits etched onto its surface.

those bare die silicon are common to a final package before doing the assembly, they are needed to clean tested with no footprints.

we JYPROBE provides a massively qualified and manufactured test sockets for ATE or open-top quick testing, upto 200amp current in small size 3.5x3.5mm.

this bare die ic test socket can keep a very soft contact over 20 million cycles lifespan.

1.lower working travel

2.lower spring force compared to normal Cantilever probe

3.lower contact resistance on each pin.