Pin Holes

0.17mm Pitch Socket

Ultra-fine pitch test sockets

JYPROBE's ultra-fine pitch IC test sockets address the growing challenges of high-density packaging technologies such as BGA, QFN, Bare Die, MicroLED, and MiniLED. With a minimum pitch of ‌0.17mm (170μm)‌, our solutions deliver exceptional performance and reliability for demanding testing environments6. Key features include:

‌Ultra-Fine Pitch‌: Supports down to ‌0.17mm spacing‌, enabling high-density testing for advanced packaging;
‌Stable Signal Transmission‌: Ensures signal integrity even in high-frequency applications;
‌Precision Mechanical Design‌: Incorporates floating protection mechanisms to safeguard delicate components;
‌Flexible Array Configuration‌: Customizable multi-directional arrays and localized contact layouts for complex test requirements;
‌Thermal Stability‌: Exceptional resistance to thermal expansion/contraction under extreme temperature conditions;
‌High Precision‌: Positioning accuracy up to ‌0.005mm‌, critical for micron-level alignment.

These sockets are widely applicable in ‌semiconductor ATE testing‌, ‌advanced packaging validation‌, and ‌high-reliability scenarios‌ such as automotive electronics and AI accelerators.