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 PACKAGE TYPE:  LGA
 PITCH: 0.35MM/0.4MM/0.5MM/0.65MM/0.8MM/1.0MM/1.27MM
 MATERIALS: PEEK/ TORLON
 STRUCTURES: DOUBLE SNAP/ ROTATE/ CLAMSHELL/ OPEN-TOP
CONDUCTOR: SPRING LOADED PROBE
 CONTACT RESISTANCE PER PIECE: <50mOhm
 HIGH TEMPERATURE:-40°C~150°C

 RESPONDING TO HIGH CURRENT, HIGH POWER, HIGH FREQUENCY, HIGH TEMPERATURE AND TOUGH TEST ENVIRONMENTS.
 
OFFERING A CHANCE TO MAKE THE TEST OPERATION EASY AND FAST BY AUTOMOTIVE TESTER OR ROBOT PICKING-UP, THAT WILL COST-SAVING AND TIME-REDUCING.
 
APPROACHING TO THE PROTECTIVELY TEST WITH THE SPRING-LOADED PROBES AND AVOIDING TO DAMAGING THE LGA IC CHIPS BY DIRECT CONNECT TO THE MOTHERBOARD.
 
HAVING A PROLONGED LIFESPAN WITH THE SPRING COMPRESSING WORKING METHOD.


LGA test-socket


TO USE AN LGA TEST SOCKET, YOU NEED TO FOLLOW THESE STEPS:

 INSERT THE TEST CHIP INTO THE BOARD'S LGA SOCKET AND SECURE IT WITH A HEAT SINK AND SCREWS

CONNECT THE TEST CHIP LAYING ON THE SOCKET SUITABLE.
CONFIGURE THE TESTER TO APPLY VOLTAGE, CURRENT, AND DIGITAL VECTORS TO THE TEST CHIP AND MEASURE THE ELECTRICAL SIGNALS
ANALYZE THE TEST RESULTS TO CHECK FOR ANY MECHANICAL OR ELECTRICAL FAULTS IN THE SOCKET-TO-BOARD OR SOCKET-TO-PROCESSOR CONNECTIONS

MORE SOLUTIONS

An LGA IC test socket is a electronical and high precision device to interconnect the LGA IC chip to interface motherboard PCB to check all specifications.

With the fast changing of IC package types and decades of experience of IC test socker innovations, we offer a numerous of LGA IC test sockets to support various applications. We have specialized various IC test socket technology. An LGA IC is an integrated circuit (IC) that has a flat pad grid array (LGA) package. This means that the IC has flat connectors, or 'lands', on its underside that can be electrically connected to a printed circuit board (PCB) either by using a socket or by soldering directly to the board LGA ICs are often used for microprocessors of various families.

We provide a customized design and innovated test socket to LGA IC chips. LGA IC test socket is made of the special insulating and heat resisting materials, and is installed by a series of spring contact probes that correspond to flat connectors on the bottom of the LGA IC. And the spring contact pins are flexible in the test socket as the designed requirement, we are creating a floating and stable loading system to ensure contact accuracy and reliability.



LGA-PACKAGE-IC

(TCM-BF537_HUM_V1-253190)

LGA TEST SOCKET FOR BLUETECHNIX IC
DOCUMENTS
LGA- test-socket for bluetechnix
TCM-BF537_HUM_V1-253190

LGA IC Test Sockets

INQUIRY

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