With the continuous expansion of application scenarios of RF circuit boards at the customer front end, RF board manufacturers have gradually abandoned the traditional design method of soldering coaxial connectors to adapt to the small-pitch design of gold-plated points and achieve cost optimization, making the GS point structure the mainstream choice for RF signal transmission design. However, such RF boards expose numerous technical pain points in the 12GHz high-frequency test scenario, leading to unreliable test data and low efficiency of the test process. The specific problems are as follows:
Poor high-frequency signal transmission performance: Severe signal attenuation and poor standing wave performance in the 12GHz high-frequency environment directly result in unstable test signals and low accuracy of test results.
Mismatched probe impedance: For 1.0mm small-pitch GS test points, ordinary probes cannot achieve impedance matching, leading to prominent signal crosstalk, distorted test data and lack of reference value.
Low adaptability to high-density boards: The narrow test space of high-density PCB boards makes the needle insertion operation of ordinary probes difficult and prone to interference with the test structure, affecting the test operation.
Insufficient probe bandwidth: The limited bandwidth performance of ordinary probes leads to direct signal distortion and probe failure under the 12GHz high-frequency condition, making it impossible to complete effective tests.

II. Custom Probe Solution
In response to the above core pain points of 12GHz GS RF test point testing, a customized special probe test scheme is launched, which is optimized from multiple dimensions such as bandwidth, pitch adaptation, impedance matching, structural design and signal transmission to fully solve the testing problems in high-frequency, small-pitch and high-density scenarios. The specific characteristics are as follows:
Ultra-wideband stable testing: Supports full-band signal testing from DC to 12GHz, ensuring the stability and continuity of signal transmission in the core 12GHz high-frequency scenario without signal disconnection or distortion.
Precise adaptation to small-pitch design: Perfectly matches 1.0mm small-pitch GS signal points, conforms to the current small-pitch design trend of RF boards, and solves the problems of signal contact and transmission in small pitches.
50Ohm precise impedance matching: Adopts a 50Ohm standard impedance design to achieve precise impedance matching, greatly reduce signal loss and standing wave ratio, fundamentally solve the problem of signal crosstalk, and ensure the authenticity and accuracy of test data.
Small size adapted to high-density environment: Adopts a small-volume structural design, suitable for the narrow test space of high-density PCB boards, with flexible needle insertion operation, effectively avoiding interference with the test structure and improving the convenience of test operation.
High-reliability plug-and-pull and signal transmission: Equipped with a quick plug-and-pull interface, the plug-and-pull operation is efficient and convenient, and the interface connection has strong stability, which can ensure the stable input and output of 12GHz high-frequency signals and meet the use requirements of multiple repeated tests.

III. Core Advantages of the Scheme
Performance adaptability: Fully matches the high-frequency, small-pitch, and high-density design characteristics of 12GHz GS RF boards, and solves the core performance pain points of traditional test schemes.
Test accuracy: Thoroughly solves the problems of signal crosstalk and distortion through impedance precise matching, low loss and low standing wave design, ensuring reliable and repeatable test data.
Operational convenience: The small-volume structure plus quick plug-and-pull interface reduces the difficulty of on-site test operation, reduces interference problems, and improves the efficiency of the test process.
Scenario compatibility: Supports ultra-wideband testing from DC to 12GHz, which is not only suitable for the current core 12GHz scenario, but also can meet the testing requirements of low-frequency RF boards with strong compatibility.
IV. Applicable Scenarios
This test scheme and special probe are suitable for high-density RF circuit boards with a 12GHz high-frequency band and 1.0mm small-pitch GS point design, and can cover the whole-process test scenarios such as R&D testing, factory inspection, and customer incoming material inspection of RF board manufacturers.
V. Expected Test Effects
Controllable signal attenuation and excellent standing wave ratio performance at 12GHz high frequency, with continuous and stable test signals without distortion or crosstalk.
Significant improvement in the accuracy of test data of 1.0mm small-pitch GS points, and the test results can be directly used as an effective reference for R&D, production and quality inspection.
No interference in needle insertion during the test of high-density PCB boards, efficient plug-and-pull operation, shortened test time for a single board, and improved overall test efficiency.
The probe can still maintain stable signal transmission performance after multiple repeated plug-and-pull tests, ensuring the continuity and stability of the test process.
Measured Data

S21 -0.68dB@12GHz
Installation Dimensions
The distance between RF probes can be within 4mm.
The installation height is within 30mm.
The pressing stroke is controlled within 1.75mm.
Datasheet